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      <title>麒麟2026晶体管密度暴涨55%：华为τ定律如何突破制裁</title>
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      <description>麒麟2026芯片晶体管密度暴涨55%，这一实测数据来自何庭波9月4日在ChinaXiv发布的预印本论文《华为 τ（韬）芯片本该过热烧毁？》。论文同时更新了τ定律底层原理，显示华为在先进制程受限情况下仍完成显著工艺跃升。 这一成果直接来自实测而非理论推演。何庭波在论文中详细记录了麒麟2</description>
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